1. Do not dip the body of a capacitor into a solder bath. Expose terminals only to the solder and keep the PC board between the body of the capacitor and the solder.

2. Soldering conditions (preheat, solder temperature and exposure time) should be within the limits specified in the product literature.

3. Do not apply flux to any part of the capacitors other than the terminals.

4. Do not let adjacent components lean against the capacitor while soldering.

1. Dipping the capacitor body into the melted solder will increase the temperature of the capacitor, increase internal gas pressure and damage the capacitor.

2. Applying excessive soldering conditions (time and temperature) beyond the limits specified in the product literature may overheat and damage capacitors. For non-solid aluminum electrolytic capacitors, the solder bath temperature and exposure time, in general, should be limited to 260&C for 10 seconds.

3. If flux is inadvertently applied to the rubber seal of a capacitor, halogenated activators in the flux may penetrate the capacitor, causing corrosion and an eventual open circuit failure.

4. Care should be taken so that high heat-conductive components such as resistors and ceramic capacitors do not touch or lean against a capacitor while soldering. The lead wires or other exposed metals of the adjacent components will conduct soldering heat to a capacitor, crack the outer sleeve, and expose the bare aluminum can. When an adjacent component comes in contact with the exposed bare can, the capacitor will be destroyed and the device circuit will malfunction.