1. Do not use any adhesive or coating material containing halogenated solvents.

2. Before applying non-halogenated adhesives or coating materials, remove flux and residue from the rubber seal of the capacitor and PC board.

3. Before applying adhesives or coating materials to the capacitors, evaporate the residual cleaning agent.

4. Do not cover the entire surface of the rubber seal of the capacitor with adhesives or coating materials.

5. Do not exceed permissible heating conditions for curing adhesives or coating materials as specified in the product literature.

1. Using adhesives or coating materials containing halogenated solvents will result in halogenides entering the capacitor through the rubber seal, causing corrosion and subsequent venting or open circuit failure while in service.

2. Flux and residue left on the surface of the rubber seal of a capacitor or trapped between the rubber seal and PC board contain halogens. Covering the rubber seal with non-halogenated adhesives or coating materials before removing the flux and residue will trap halogenides that can penetrate the capacitor and cause corrosion and subsequent venting or open circuit while in service.

3. Inadequate evaporation of cleaning solvents will leave residue on the surface of the rubber seal of a capacitor or be trapped between the rubber seal and PC board. This residue contains halogenides from the flux even though non-halogenated cleaning solvents have been used during the cleaning process. Covering the rubber seal surface with adhesives or coating materials before properly removing cleaning solvent residue will allow halogenides to enter a capacitor and cause corrosion and subsequent venting or open circuit failure while in service.

4. Covering the entire surface of the rubber seal of a capacitor with an adhesive or coating material will prevent the normal diffusion of internal hydrogen gas and electrolyte vapor from a capacitor. This will cause a gradual increase in internal pressure and eventually damage the capacitor.

5. When the heating conditions for curing adhesives or coating materials exceed limits specified in the product literature, the heat may crack, split or shrink the outer sleeve of a capacitor, or cause an increase in internal gas pressure resulting in a bulged vent or electrical failure such as a capacitance decrease.

When leaded capacitors are mounted on the PC board along with surface mount components that are affixed with adhesives, excessive heat curing will crack, split or shrink the outer sleeves of the capacitors.